• Process Capability
  
• System Specification
  
• Design Capabilities
  

     In February 2000 APT introduced the BHASKAR APT 18D1T a large substrate Single layer Sputter Deposition System. The system is designed to deposit by RF/DC Magnetron a single layer of material (metal/non-metal or magnetic/non-magnetic) thin/thick film. This system with the loadlock has been designed to replace poor quality thin/thick film deposition by evaporation. The tool can also be used as a batch system for smaller substrate sizes

     Vacuum isolation between the process chamber and the loadlock provides a contamination free cleaner operation. With cycle times less than 20 minutes this is an ideal tool for Production and Research.

Vacuum
Various options available based on process requirement. High Vacuum - Cryo, Turbo, Diffusion Rough - Rotary Vane or Dry pump
Vacuum Stages -Process Chamber
< 1E-8 torr (1.3E-11 bar) Cryopump
< 1E-7 torr (1.3E-10 bar)Turbopump
< 5E-7 torr (6.5E-10 bar) Diffusion
Load Lock < 1E-2 torr (1.3E-2 mbar)

Footprint
Process Module with Loadlock 0.75 m x 1.5 m (2.5' x 5')
Process Module without Loadlock 0.75 m x 0.75 m (2.5' x 2.5')
Remote Power/Control Cabinet 0.6 m x 0.6 m (2' x 2')

Controls
Manual Control - Pump Down Sequence for the process and loadlock
is automatic. Safety interlocks provided
Automatic - Fully Computer controlled. Proprietary Control Software.

Target
One 18" diameter target bonded to the backing plate.

Uniformity
Within substrate (16" diameter) < 5% 3-sigma
(49 point mapping; 6 mm edge exclusion)

Cycle Time
Process Chamber without Loadlock < 3 hours (some processes only)
< 8 hours (Ultra Clean Processes)
Process Chamber with Loadlock < 20 minutes

Substrate
12 Round (4" diameter) or 9 Square (4"length)
8 Round (6" diameter) or 6 Square (6" length)
6 Round (8" diameter) or 4 Square (8" length)
1 Round (16" diameter) or 1 square (12" length)