Advanced Process Technology
Dhruva
Click here for Semiconducor and Optical Coatings Group
Products:
Rainbow
Bhaskar
MRS
SEM SC
Dhruva
Contact Us
Home
Click here for Metallurgical Applications Group
Click here for Company Profile
DHRUVA PMSS SERIES
Planar Magnetron Sputtering Sources

     APT Development Engineers started working in 1999 with a goal to develop efficient planar magnetron cathodes for the thin film industry. We focused on flexibility of application and improving target utilization . The DHRUVA PMSS Series Planar Magnetron Sputtering Sources series were announced in February 2000. Our cathodes allow the user to configure the sputtering source so that it is optimized for specific materials, process requirements and system installation. We have created unique cathode designs based on shaping the magnetic field lines to control the erosion track. The magnet pack design gives better target utilization (> 50 %) and uniform coatings (< 5% 3-sigma).

 
Unique Features
  • Dhruva Round cathodes available in sizes from 2" dia. to 18" dia.
  • Dhruva Rectangular Cathodes available in sizes from 5", 6" and 8" widths (Lengths from 12" to 36" length)
  • Proprietary Rotaing Magnet Pack design (for round cathodes from 6" dia. to 18" dia.).
  • Innovative backing plate water cooling design ensures uniform cooling of the target. (Magnets isolated from cooling water thus eliminating corrosion problems)
  • Designs for sputtering of variety of magnetic materials.
  • Universal Power Provision (RF, DC or Pulsed DC)
  • Target Utilization >43% (for non magnetic materials)
  • Film Uniformity <8 % 3-sigma (Guaranteed >5% 3-sigma with our sputter systems)
  GotoTop
  System Specification
    Target Thickness
    Non-Permeable Materials
  • dia, 2" to dia, 4" Cathode: 0.125" to 0.25" thickness
  • 6" dia. to 18" dia. Cathode: 0.25" thickness (for deposition of nonmetals)
  • 6" dia. to 18" dia. Cathode: 0.25" to 0.5" thickness (for deposition of metals)
  • Rectangular Cathode: 0.25" thickness (for deposition of nonmetals)
  • Rectangular Cathode: 0.25" to 0.5" thickness (for deposition of metals)
    Permeable Materials
  • Cobalt and its alloys: 0.375"
  • Nickel Target: 0.25"
  • Iron Target: 0.065" (1.65 mm)
  • Permalloy Target: 0.20"
Note: Magnetic materials suffer from high degree of magnetic pinching as sputtering progresses. Our magnet designs avoid this problem and provide uniform sputtering conditions throughout the target life
    Materials of Construction
  • Cathode Support Plate: SS304
  • Backing Plate: SS304 (low power) and OFHC Cu (High Power)
  • Insulators: Teflon
  • O-rings: Viton
  • Magnet Pack Assembly: Nd-Fe-B magnet array or Samarium Cobalt array
  • Ground Shielding: SS304
  • Water Fittings: SS316 and Brass (For RF applications SS304 is electroplated with a low RF resistivity material)
  • Water Lines: Polyproylene
    Power
    RF, DC or pulsed DC (Threaded connector and hard power connections provided as per application.)

  GotoTop
 

[Profile] [Services] [Expertise] [Technology]
[Philosophy] [Contact Us] [Applications] [Home]

Best Viewed in Internet Explorer 4.0 & Netscape 4.0 or Higher Versions
with 800x600 Pixels Screen Resolution
©Copyright 2000, Advanced Process Technology Pvt. Ltd. Pune, India
All rights reserved.