In February 2000 APT introduced the RAINBOW APT 6D4T a high throughput Multi-layer Sputter Deposition System. The tool is designed to provide process flexibility by enabling the user to deposit layers by RF/DC Magnetron upto 4 different metals/non-metals or magnetic/non-magnetic thin/thick films in a single chamber without breaking vacuum.

     The tool allows several materials to be deposited sequentially in one pumpdown. Process contamination is eliminated by a shutter over the target. Vacuum isolation between the process chamber and the loadlock provides a contamination free cleaner operation. With cycle times less than 20 minutes this is an ideal tool for production and research.