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APT has the following technologies available that help us make world class products.
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- Ultra-Clean Processing Technology
- Production-worthy Equipment Technologies for Sputtering, PECVD and Reactive Ion Etch.
- Proprietary high performance planar Magnetron Sputtering Cathode (DC, RF and pulsed DC)
from 2" to 18" diameter. (Patent Application to be filed soon in USA, Europe, Japan and India)
- Low cost Efficient System Automation Design. (SCADA / MMI)
- Proprietary material for "zero" TCR Laser Trimmable Chip Resistors. (TCR can be tailor made to give -100 to +100 ppm/°C)
- Temperature controlled Gas/liquid Delivery System for PECVD / CVD/ MOCVD applications. (Upto 6 channels with pump/purge capabilities on all channels)
- Advanced Plasma Nitriding Equipment and Process Technology ready for Industrial use.
- Plasma Metallurgical Systems for Cladding, Spraying, Melting and Heating.
- State of the art DC and pulsed DC Power Supply Technology
(Pulse - 1 kHz to 1 MHz, Output voltage - 0 to 1 kV,
Power Rating - 0.2 kW to 100 kW) for Semiconductor and Metallurgical Applications.
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State of the Art Control & System Automation
Proprietary Automation and Control System fully complying with MESC and GEM standards. (SECS II Communication protocols)
All instrumentation interfaced to the control system providing real-time process control.
SCADA (Supervisory Control and Data Acquisition) include -
- Data Server and Data Logger
- Display Module
- Alarms Manager
- Process Recipe Management etc.
User friendly MMI (Man Machine Interface)
Extensive error-trapping to prevent inappropriate or unsafe steps.
Built-in Hardware and Software interlocks for complete safety of the user and safeguarding of expensive instrumentation.
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